发明名称 |
Polishing method and polishing apparatus |
摘要 |
<p>A method is provided for polishing a device wafer (14), which has projections and depressions formed on a surface thereof, with the use of an abrading plate (12). The method comprises polishing the device wafer (14) while supplying a surface active agent and/or while dressing a surface of the abrading plate (12). This method for polishing the device wafer (14) can always exhibit a self-stop function, without being restricted by the composition of the abrading plate (12), and without being restricted by the type of the substrate. <IMAGE></p> |
申请公布号 |
EP1077108(A1) |
申请公布日期 |
2001.02.21 |
申请号 |
EP20000117724 |
申请日期 |
2000.08.17 |
申请人 |
EBARA CORPORATION |
发明人 |
WADA, YUTAKA;HIYAMA, HIROKUNI;HIROKAWA, KAZUTO;MATSUO, HISANORI |
分类号 |
H01L21/304;B24B53/007;B24B53/017;(IPC1-7):B24B37/04 |
主分类号 |
H01L21/304 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|