发明名称 |
Composition for use in a chemical-mechanical planarization process |
摘要 |
<p>Provided are methods for making a slurry composition, suitable for use in a chemical-mechanical planarization process. Also provided are compositions made by such methods. The methods comprise combining: (a) abrasive particles; (b) a suspension medium; (c) a peroxygen compound; (d) an etching agent; and (e) an alkyl ammonium hydroxide. The methods and compositions of the present invention are particularly applicable to the semiconductor manufacturing industry.</p> |
申请公布号 |
EP1077241(A2) |
申请公布日期 |
2001.02.21 |
申请号 |
EP20000402293 |
申请日期 |
2000.08.16 |
申请人 |
L'AIR LIQUIDE, SOCIETE ANONYME POUR |
发明人 |
MISRA, ASHUTOSH;HOFFMAN, JOE G.;SCHLEISMAN, ANTHONY J. |
分类号 |
B24B37/00;C09G1/02;C09K3/14;C09K13/00;C09K13/08;H01L21/304;H01L21/306;H01L21/3105;(IPC1-7):C09G1/02;H01L21/310 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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