Universal land grid array socket engagement mechanism

摘要

A ring shaped pressure plate is provided in a socket and land grid array module assembly for urging the module into electrical contact. The ring shaped pressure plate is not only readily removable but it also engages a land grid array module in a fashion which reduces stress to chip, chip underfill, chip lid, and chip thermal paste structures. In an alternate embodiment of the present invention, pressure is applied in a similar manner except that lockably engageable arms supporting pressure rails on opposite sides of the module are employed. Both embodiments reduce stress and provide a land grid array engagement mechanism which is readily removable and which also provide a central opening or central portion access to chip module components for purposes of cooling such as by providing direct attachment to heat sinks or indirect attachment to heat sinks through heat spreaders.