发明名称 SOLDERING DEVICE FOR MICRO OBJECT
摘要 <p>PROBLEM TO BE SOLVED: To provide a soldering device for a micro object which can perform each soldering cycle in short time, does not need an exchange of a soldering tool for a long time, and has a long cycle of readjustment of a recognizing original point of a picture recognition in soldering of a fine lead wire and other micro objects. SOLUTION: The device is constituted of a XY table 1 which constitutes a part of a positioning means, a preheating plate 2 which is placed on the table, preheats an end of a lead wire 3 and a part of a antenna terminal 4 of IC7 being objects of the soldering, a laser beam irradiation device 5 irradiating the end of the lead wire 3 and the antenna terminal 4 installed and positioned on the preheating plate 2 with the laser beam, a picture recognizing device 6 recognizing postures and positions of the lead wire 3 and antenna terminal 4 by the picture, and a controller controlling operation of each part.</p>
申请公布号 JP2001047221(A) 申请公布日期 2001.02.20
申请号 JP19990228063 申请日期 1999.08.11
申请人 STAR ENGINEERING CO LTD 发明人 HOSHI KATSUJI;TEZUKA HIROYUKI
分类号 B23K26/02;B23K1/00;B23K1/005;B23K26/03;(IPC1-7):B23K1/005 主分类号 B23K26/02
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