发明名称 SILICONE-MODIFIED EPOXY RESIN, ITS PRODUCTION AND SILICONE- MODIFIED EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a silicone-modified epoxy resin using bisphenol-A or bisphenol-F as a base, having a high heat resistance and useful as a coating capable of being applied to a heating tool such as an oven. SOLUTION: This silicone-modified epoxy resin of formula I (Ep expresses Me or a group of formula II) is obtained by heating and melting an epoxy resin based on general bisphenol-A or bisphenol-F at 50-150 deg.C, adding 5-50 wt.% methoxy group silicone intermediate based on the total weight of the reacting material and heating at 150-200 deg.C. It is preferable that the density of the methoxy group silicone intermediate is 1,120-1,140, its viscosity is 50-100 cp (at 25 deg.C), and methoxy content is 14.0 to 16.0.
申请公布号 JP2001048953(A) 申请公布日期 2001.02.20
申请号 JP20000123038 申请日期 2000.04.24
申请人 KOKUDO CHEMICAL CO LTD 发明人 CHON SUU PAAKU;JIN SEON YU;DEUKU SUN BAE
分类号 C08G59/14;C08G77/42;C08L83/10;C09D5/03;C09D163/00;C09D183/10;(IPC1-7):C08G59/14 主分类号 C08G59/14
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