| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composition which does not contain a bromine flame- retardant agent nor an antimony compound, has a small influence on the environment and has an improved soldering heat-resistance and an improved high- temperature stock reliability after mounting by blending an epoxy resin, a binphenyl novolak resin, triphenyl phosphine and silica powder having a specific particle size. SOLUTION: An epoxy resin composition is obtained by blending at least one epoxy resin selected from 6-cresol novolak epoxy resin of formula I, biphenyl epoxy resin of formula II and an epoxide of a phenol xylene resin of formula III, biphenyl novolak resin of formula IV, 0.01-5 wt.%, against the resin composition component, of triphenyl pohosphine, and 80-95 wt.%, against the whole resin component, of silica powder having a maximum particle size of not more than 100μm. In the formulas, (n) is 1 or more; and R1 is H or an alkyl. This composition does not contain a bromine flame-retardant agent nor an antimony compound.
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