发明名称 |
Package structure for low cost and ultra thin chip scale package |
摘要 |
Thin organic layers are laminated on both the top and bottom of a relatively thin ceramic layer to form a reliable thinner composite substrate for packaging a chip-scale flip-chip die in a thin package. A semiconductor die has a number of solder bump-mounting pads formed thereupon which are connected with solder bumps to mounting pads on the top surface of the thin composite substrate.
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申请公布号 |
US6191483(B1) |
申请公布日期 |
2001.02.20 |
申请号 |
US19990306517 |
申请日期 |
1999.05.06 |
申请人 |
PHILIPS ELECTRONICS NORTH AMERICA CORPORATION |
发明人 |
LOO MIKE C. |
分类号 |
H01L21/56;H01L23/14;H01L23/31;H01L23/498;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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