Semiconductor chip carrier having partially buried conductive pattern and semiconductor device using the same

摘要

A semiconductor chip is mounted on a semiconductor chip carrier through a flip chip bonding technique; the semiconductor chip carrier includes an insulating layer such as synthetic resin having a mounting area assigned to the semiconductor chip and a conductive pattern having pads bonded to bumps of the semiconductor chip, and only the pads are formed in the mounting area so that melted synthetic resin smoothly flows into the gaps between the insulating synthetic resin layer and the semiconductor chip.