Controlled low impedance high current circuit board interconnect

摘要

An apparatus for electrically interconnecting circuit boards and providing controlled low impedance current paths. A first conductive member has a first surface, a second surface and a third planar surface, the first surface attaches to a first circuit board or CIM and the second surface attaches to a second circuit board or CIM. An insulative sheet having dielectric properties is aligned parallel to the third surface of the first conductive member. A second conductive member has a fourth surface, a fifth surface and a sixth planar surface, the fourth surface connects to the first circuit board and the fifth surface is for attaching to the second CIM. The sixth planar surface is aligned parallel to the insulative sheet, such that a controlled low impedance high current interconnect can be achieved between the first CIM and the second circuit board responsive to the dielectric properties of the insulative sheet.