| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating device capable of maintaining a black film deposited on a surface of an anode electrode in a stable condition and implementing the plating of excellent quality without adhering bubbles to a surface of a substrate to be plated, or without exposing an anode electrode into an air from the plating solution even in changing the substrates to be plated. SOLUTION: A substrate 17 to be plated is arranged with its surface to be plated directed upward, an anode electrode plate 14 is arranged opposite to the surface to be plated, an ion exchange resin or a porous neutral film 11 is arranged between the substrate 17 to be plated and the anode electrode plate 14, the anode electrode plate side as an anode chamber 12 is separated from the substrate side as a plating solution chamber 13, a porous plate 15 is provided on a lower surface of the plating solution chamber 13, and a specified solution and the plating solution are introduced in the anode chamber 12 and the plating solution chamber 13, respectively.
|
