发明名称 |
COMPOSITE LAMINATE AND ITS MANUFACTURE |
摘要 |
PROBLEM TO BE SOLVED: To inexpensively provide a composite laminate suitable for an application as a multilayer circuit board capable of advantageously forming an external conductive film finely patterned on a main surface by providing the surface having good surface roughness. SOLUTION: The composite laminate is provided by preparing a raw laminate 1 having a first sheet layer 4 containing a glass powder 3 and a second sheet layer 6 provided to give at least one main surface brought into contact with the layer 4 and containing a ceramic powder 5, heat treating the laminate 1 at a temperature capable of melting the powder 3 while sintering the powder 5 to fix the layer 4 by the molten glass 9 and impregnating the layer 5 with the powder 5 so as to fix the powder 5 to one another. Surface roughness of the main surface is influenced by a particle size of the powder 5 contained in the layer 6. Good surface roughness can be obtained by finely granulating only the powder 5. |
申请公布号 |
JP2001047423(A) |
申请公布日期 |
2001.02.20 |
申请号 |
JP19990225131 |
申请日期 |
1999.08.09 |
申请人 |
MURATA MFG CO LTD |
发明人 |
KURODA SHIGEYUKI;KAMEDA HIROKAZU;NAKAO SHUYA;TANAKA KENJI;KOJIMA MASARU |
分类号 |
B28B11/00;B32B17/06;B32B17/10;B32B18/00;C03C17/00;H05K1/03;H05K3/46;(IPC1-7):B28B11/00 |
主分类号 |
B28B11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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