发明名称 COMPOSITE LAMINATE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To inexpensively provide a composite laminate suitable for an application as a multilayer circuit board capable of advantageously forming an external conductive film finely patterned on a main surface by providing the surface having good surface roughness. SOLUTION: The composite laminate is provided by preparing a raw laminate 1 having a first sheet layer 4 containing a glass powder 3 and a second sheet layer 6 provided to give at least one main surface brought into contact with the layer 4 and containing a ceramic powder 5, heat treating the laminate 1 at a temperature capable of melting the powder 3 while sintering the powder 5 to fix the layer 4 by the molten glass 9 and impregnating the layer 5 with the powder 5 so as to fix the powder 5 to one another. Surface roughness of the main surface is influenced by a particle size of the powder 5 contained in the layer 6. Good surface roughness can be obtained by finely granulating only the powder 5.
申请公布号 JP2001047423(A) 申请公布日期 2001.02.20
申请号 JP19990225131 申请日期 1999.08.09
申请人 MURATA MFG CO LTD 发明人 KURODA SHIGEYUKI;KAMEDA HIROKAZU;NAKAO SHUYA;TANAKA KENJI;KOJIMA MASARU
分类号 B28B11/00;B32B17/06;B32B17/10;B32B18/00;C03C17/00;H05K1/03;H05K3/46;(IPC1-7):B28B11/00 主分类号 B28B11/00
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