发明名称 Polishing apparatus
摘要 A polishing apparatus comprises a table having a smooth surface, a polishing pad provided on the smooth surface and a carrier for carrying an article to be polished The carrier brings the article into engagement with the pad under a pressure. The carrier and the table with the polishing pad are repeatedly moved relative to each other in a predetermined direction to thereby polish the article. A pressing device is positioned at a position spaced from the carrier is and adapted to be engaged with the polishing surface of the polishing pad. The pressing device includes a plurality of pressing elements which are arranged across an area of the polishing surface which area is to be brought into engagement with the article carried by the carrier and are adapted to individually press successive corresponding portions in the area to arrange the configuration of the surface of the area under corresponding various pressures.
申请公布号 US6190243(B1) 申请公布日期 2001.02.20
申请号 US19990306985 申请日期 1999.05.07
申请人 EBARA CORPORATION 发明人 WADA YUTAKA;HIYAMA HIROKUNI;HIROKAWA KAZUTO;MATSUO HISANORI
分类号 B24B37/04;B24B53/007;(IPC1-7):B24B21/18 主分类号 B24B37/04
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