| 摘要 |
PROBLEM TO BE SOLVED: To completely fill a resin in a cavity and to prevent a flash at a molding by deviating an inside end of an upper side half mold for forming a mold to an inside with respect to an inside end of a lower side half mold, and cooperating a spoiler of a lead frame to limit an opening dimension of a slit. SOLUTION: A semiconductor die 1 is assembled on a depressed central pad 2 of a lead frame 3 made of a metal, and sealed in a cavity 6 formed of both upper and lower half molds 4 and 5. Then, a slit 7 is formed at adjacent parts to the pad 2 and the frame 3, and a resin is charged in the cavity 6 from the slit 7. That is, one end 8 of the pad 2 is bent upward to form a deflecting plate and a spoiler, and the slit 7 is formed. An inside end of the mold 4 is deviated to the inside with respect to the inside end of the mold 5, and when the molds 4, 5 are connected, a size of the slit 7 is reduced. Thus, the resin can be completely charge din the cavity 6. |
