VACUUM TREATING DEVICE AND VACUUM TREATING METHOD

摘要

PROBLEM TO BE SOLVED: To reduce the damage of the charge-up of the substrate to be treated in a vacuum treating device of a downflow system in which a plasma generating mechanism applied with high frequency electric power, and a reaction gas feeding means feeding reaction gas are provided on the upper part of the vacuum vessel, and the substrate to be treated is insalled to the lower part of the gas feeding port of the reaction gas feeding means in the vacuum vessel. SOLUTION: The inside of a plasma generating vacuum vessel 4 is disposed with a columnar porous ceramic 17 diffusing reaction gas fed from a gas feeding port 13. In this way, reaction gas can be diffused in the plasma generating vacuum vessel 4, by which the imadiation of radicals and ions in the plasma driven by the flow-down of the reaction gas on the substrate 1 to be treated can be relaxed.