| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition for electronic components which has an excellent temperature-cycle resistance and therefore improves the ply separation caused by repetitive temperature change, which is a problem observed in adbesives used for semiconductor devices such as BGA, CSP, etc., and an adhesive sheet. SOLUTION: An adhesive composition essentially comprises (a) an epoxy resin, (b) an epoxy hardener and (c) an elastic body. Here, the ratios of the dynamic elastic moduli at -50 deg.C, 50 deg.C and 150 deg.C affer heating the cured adhesive composition at 150 deg.C for 250 hr, to the elastic moduli at the corresponding temperatures before the heat treatment, are all within the range of from 0.1 to 10.
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