| 摘要 |
Provided is an epoxy resin composition comprising:(A) an epoxy compound represented by the general formula (1):wherein, R1 to R9 represent each independently a hydrogen atom, an acyclic or cyclic alkyl group having 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group or a halogen atom,(B) a polyfunctional epoxy compound having a functional group number of two or more, and(C) an epoxy curing agent containing a phenolic hydroxyl group,wherein the proportion of the epoxy compound (A) is from 1 to 99% by weight based on the total weight of the epoxy compounds (A) and (B).The epoxy resin composition has low moisture absorption and other properties well-balanced for use as a material for encapsulating electronic parts.
|
