| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating device to set the uniform and sufficiently large relative speed between a surface to be plated of a substrate and a plating solution over a whole area of the surface to be plated of the substrate. SOLUTION: This plating device comprises a cylindrical plating tank 12 to maintain a plating solution 10, a substrate holding part 14 to hold a substrate W in an attachable/detachable manner and horizontally hold the substrate so that a lower surface to be plate of the substrate W is brought into contact with the plating solution 10 in the plating tank 12, a relative speed generating means 38 to generate the variable relative speed between the substrate W held by the substrate holding part 14 and the plating solution 10, and a control part 52a to control the relative speed generating means 38.
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