发明名称 RESIN SEALING DEVICE
摘要 PROBLEM TO BE SOLVED: To apply the low pressure and low mold clamping operation and shorten the molding time, make voids hardly generate and control the amount of use of a sealing resin. SOLUTION: A resin injection hole 81 for a pot 15 is opened directly on a central section of a cavity face 71 of a cavity 7 of a bottom force 122 constituting a mold 12 in a resin sealing device 1. A plunger 16 for injecting a resin R melted in the pot 15 from the side opposite to the side of the resin injection hole 81 into the cavity 7 is fitted slidably while being in the airtight state with the inner wall of the pot 15.
申请公布号 JP2001047458(A) 申请公布日期 2001.02.20
申请号 JP19990225525 申请日期 1999.08.09
申请人 SONY CORP 发明人 TAWARA MASAKAZU;EBARA TOSHIYUKI;HATAKAWA KAZUHIKO;ITO SADAYUKI
分类号 H01L21/56;B29C45/02;B29C45/14;(IPC1-7):B29C45/02 主分类号 H01L21/56
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