发明名称 |
Fabricating method of semiconductor package |
摘要 |
A method of forming a semiconductor package that includes at least one structure having a central hole formed at a center portion of the structure, a plurality of outer holes around the center hole, and a plurality of conductor pieces buried in the outer holes; at least one TAB having lead lines extending from sides of the TAB, the TAB having a configuration substantially corresponding to the central hole of the structure and formed over the central hole of the structure; and a molding material covering at least a portion of the TAB.
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申请公布号 |
US6190946(B1) |
申请公布日期 |
2001.02.20 |
申请号 |
US19990422729 |
申请日期 |
1999.10.22 |
申请人 |
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. |
发明人 |
SHIN MYEONG-JIN |
分类号 |
H01L23/28;H01L21/56;H01L23/12;H01L23/13;H01L23/31;H01L23/36;H01L23/433;H01L23/498;H01L25/065;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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