| 摘要 |
The present invention relates to an interposer substrate (310) for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit (4100) chips in either a single or a combination, and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. |
