APPARATUS FOR CONTROLLING SOLUTION PRESSURE OF WAFER RINSER

摘要

PURPOSE: An apparatus for controlling a solution pressure of a wafer rinser is provided to enhance efficiency of a fabricating process and remove efficiently alien substances from a wafer by varying a pressure of solution injected to the wafer. CONSTITUTION: A vacuum chuck(12) for loading a wafer(W) is installed in an inside of a chamber(11). The vacuum chuck(12) is connected with a drive motor(13) and a shaft(13A). The vacuum chuck(12) is rotated by a driving force of the drive motor(13). A nozzle(14) is installed on an upper side of the vacuum chuck(12) in order to inject a solution to a surface of the wafer(W). The nozzle(14) is connected with a tank(16) by using a pipe. A pump(15) is installed between the nozzle(14) and the tank(16). The solution is supplied from the tank(16) to the nozzle(14) by an operation of the tank(16). A valve is installed between the pump(15) and the tank(16).