发明名称 Övergång mellan stripline och mikrostrip i kavitet i flerlagers mönsterkort
摘要 The present invention relates to a multilayer printed circuit board arrangement which results in better matching between a stripline (9) and a microstrip (4) in a cavity (6). The solution comprises the use of an asymmetric stripline (9) where the electric field is tied primarily to the lower earth plane (10). This results in good matching at the transition to the microstrip (4), whose field is tied to the lower earth plane (10).
申请公布号 SE514425(C2) 申请公布日期 2001.02.19
申请号 SE19990002301 申请日期 1999.06.17
申请人 TELEFONAKTIEBOLAGET L M ERICSSON 发明人 BJOERN *ALBINSSON;THOMAS *HARJU
分类号 H05K3/46;H01L23/12;H01L23/64;H01L23/66;H01P5/08;H05K1/00;H05K1/02;H05K1/18 主分类号 H05K3/46
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