| 摘要 |
PROBLEM TO BE SOLVED: To enable a thin semiconductor device to be protected against package crackings and improved in reliability. SOLUTION: A semiconductor device is composed of tab 1e, which supports a semiconductor chip 2, leads 1a arranged around the tab 1e, bonding wires 4 which electrically connect the surface electrodes of the semiconductor chip 2 to the corresponding leads 1a, a sealing part 3 which is formed to seal the chip 2 and a part of the leads 1a which resin, and a plating blocking dam part 1k which is arranged between the tab 1e and the wire bonding end 1c of the lead 1a to prevent silver plating from adhering to the tab 1e, when the wire bonding part 1d of the lead 1a is plated with silver. By having the plating blocking dam part 1k provided around the tab 1e, by which silver plating is prevented from adhering to the tab 1e when the leads 1a are plated with silver, package crackings are prevented from occurring in a QFN 7, when it undergoes a temperature cycling test. |
