发明名称 CURABLE ADHESIVE COMPOSITION AND CURABLE ADHESIVE SHEET
摘要 PROBLEM TO BE SOLVED: To provide a curable adhesive composition which substantially does not stain the surrounding areas through exudation nor hinder cut processing before curing, has an excellent adhesion property and initial adhesion strength at an ordinary temperature, is rapidly cured without heating by irradiating light before or after its lamination on an adherend and exerts an excellent adhesion strength and impact resistance after curing, and a curable adhesive sheet using this curable adhesive composition. SOLUTION: A curable adhesive composition is prepared by adding 5 to 150 pts.wt. cationically polymerizable compound, 0 to 50 pts.wt. polyether polyol, a polyisocyanate compound and a photo-cationic polymerization initiator to 100 pts.wt. polyester polymer. Here, the equivalent ratio (NCO/OH) of the isocyanate group (NCO) in the polyisocyanate compound to the total hydroxy groups (OH) in the polyester polymer, the cationically polymerizable compound and the polyether polyol, is from 0.3 to 1. A curable adhesive sheet is prepared by laminating the above-mentioned curable adhesive composition on at least one side of a base material.
申请公布号 JP2001049222(A) 申请公布日期 2001.02.20
申请号 JP19990222795 申请日期 1999.08.05
申请人 SEKISUI CHEM CO LTD 发明人 MIURA MAKOTO;ISHIZAWA HIDEAKI
分类号 C09J7/02;C08G18/48;C09J167/00;(IPC1-7):C09J167/00 主分类号 C09J7/02
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