MANUFACTURE OF PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To enable an outer lead to be accurately and satisfactorily connected to the wiring conductor of an external electrical circuit board. SOLUTION: A semiconductor element housing package is manufactured, in such a manner that plural outer terminals 3 are joined to each peripheral side of a square flat plate-like insulating base 1 protruding outwardly in a straight line, an insulating support member strip 4 is joined to the protruding ends of the outer terminals 3 for each side of the base 1 to support them, the outer leads 3 are bent like a crank in the vertical direction between the insulating base 1 and the insulating support member 4, the insulating support members 4 are linked together with a connecting piece 5, and the surfaces of the outer lead terminals for the formation of a semiconductor element housing package. When the outer lead terminals 3 are bent, they will not be twisted, and the outer lead terminal 3 can be accurately and satisfactorily connected to the wiring conductors of an outer electrical circuit board.