| 摘要 |
PROBLEM TO BE SOLVED: To mutually electrically connect semiconductor chips which are stacked without installing terminal parts at the peripheral edge parts of the semiconductor chips. SOLUTION: In a semiconductor device 10, active faces of semiconductor chips 12 (12a to 12c) are turned in the same direction, and they are stacked by making electrode parts 16 correspond to the chips. In the semiconductor chips 12, through-holes 20 (20a to 20c), passing through the electrode parts 16 and semiconductor substrates 14, are formed. The trough-hole 20a is larger than the through-hole 20b, and the through-hole 20b is larger than the through- hole 20c. Steps are formed between the through-holes and a part of the electrode part of the semiconductor chip having the smaller through-hole is exposed to the larger through-hole. Conductive adhesive 22 is installed in the through- holes 20, and the electrode parts 16 of the semiconductor chips 12 are connected electrically. |
