| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the heat radiating property of a light emitting device where light emitting elements are fitted on a printed board, as well as light emitting efficiency, and to enable making it light-weight and compact in thcikness and size. SOLUTION: A Cu pattern adhered with Ni is formed on a metallic board, and light emitting elements are mounted thereon in a serial circuit, and then the serially conencted metallic boards are connected in parallel. Since Ni has superior correction resistance and high light reflection efficiency, the surface itself of a board can be utilized as a reflection plate. In addition, by forming a lens on the respective light emitting element the light emitting efficiency can be made to improve. In the case where a circuit is configured in region of a hybrid integrated circuit board, a mark 53 for position recognition and a flow stopper 57 are provided in a empty region, and this region is used as a reflection means by convering it with Ni.</p> |
