发明名称 COOLING DEVICE AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To obtain a cooling device which can sufficiently cool a heating element, such as the CPU, etc., even though the element generates a large quantity of heat. SOLUTION: A cooling device is constituted in such a structure that the heat generated from a heating element 6 is transferred to a heat radiating means 11 through a circulating pipe 14 and radiated from the means 11. At the same time, the electric power generated from a thermoelectric element 12 by the heat from the heating element 6 is utilized to efficiently transfer the heat from the heating element 6 to the heat radiating means 11, by making a heat conductive fluid in the circulating pipe 14 to flow.
申请公布号 JP2001044678(A) 申请公布日期 2001.02.16
申请号 JP19990217365 申请日期 1999.07.30
申请人 SONY CORP 发明人 YAZAWA KAZUAKI
分类号 H05K7/20;H01L23/427;(IPC1-7):H05K7/20 主分类号 H05K7/20
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