| 摘要 |
<p>PROBLEM TO BE SOLVED: To surely make every place and the thickness of the resist film applied to a round-type raw-material substrate used uniform, when manufacturing a large number of chip resistors, by making the peripheral edge of the raw-material substrate into a circular shape. SOLUTION: In this manufacturing method of thin-film type chip resistors, by arranging longitudinally and laterally a large number of chip substrate 1 each of which has a length L and a width W, they are integrated into a raw-material substrate A to form them into the round-type raw-material substrate A having a circular peripheral edge. Furthermore, after forming on the whole of the surface of the raw-material substrate A a photoresist film, a photolithographic processing is applied to this resist film to form in the right and left end portions of each chip substrate 1 a pair of electrodes 6. Then, after forming on the whole surface of the raw-material substrate A another photoresist film, a lithographic processing is applied to this photoresist film, to form a resistor film a at the location of each chip substrate 1. Hereupon, for formation of each of these resist films, there is used the method wherein as spinning the raw-material substrate A in the state of making it horizontal, each resist liquid being dropped in its center to slush the resist liquid on it and fling away the excess resist liquid by centrifugal force from its periphery.</p> |
