发明名称 MODULARIZED SOCKET FOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide an IC socket capable of coping with the change of the layout of pins of an IC chip by allowing the design of an interposer to be changed so as to be adapted to the IC chip or changing an adaptor unit and a cover unit. SOLUTION: A base unit 100 is a housing, has a contact pin fixed in the housing, and is welded on a printed board. An adaptor unit 300 has buckles for totally fixing a modularized socket. A cover unit 400 is used for suppressing or releasing an IC chip. When the layout of pins of the IC chip 500 is changed, an interposer 200 can be redesigned to be adapted therewith. When size of the IC chip is changed, it is necessary to change of the adaptor unit 300 and the cover unit 400, but the base unit 100 welded to a printed board is not changed. When an IC socket is damaged, a module is replaced.
申请公布号 JP2001043948(A) 申请公布日期 2001.02.16
申请号 JP19990370241 申请日期 1999.12.27
申请人 OSHIN KAGI KOFUN YUGENKOSHI 发明人 KA KANKEN;RAI UTSUKAI;KAKU KENGEN;SHA TOSON;O MEIKEN;KO KINTEN
分类号 H01R33/76;G01R31/26;H01R4/50;H01R13/24;(IPC1-7):H01R33/76 主分类号 H01R33/76
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