| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC package which is capable of supplying products of high reliability to the market by a method, wherein the IC package mounted on a circuit board is improved in mounting reliability, even when a thin circuit board is used. SOLUTION: An IC package body 1 is equipped with an IC chip and electrode pads 2 formed on its one side and is connected to the outside, and a metal projection 6 whose one end is fixed to the package body 1 and other end protrudes in the same direction with the electrode pads 2 is provided to the peripheral part of each side of the package body 1, and the projections 6 are fixed to a circuit board 4, when the electrode pads 2 are connected electrically to the outer electrodes of the circuit board 4. |
