| 摘要 |
<p>PROBLEM TO BE SOLVED: To separate a semiconductor wafer electrostatically attracted on a wafer mounting table in a vacuum vessel from the mounting table, without causing positional deviation of the wafer from the mounting table due to the flipping wafer. SOLUTION: A semiconductor wafer mounting table 2 is kept ascended beforehand, until the position where the upper surface of the table 2 is positioned higher than the upper electrode cover 4, for separating a semiconductor wafer 1 electrostatically attracted on the table 2 in a vacuum vessel 7 from the table 2, and wafer lift pins 3 are thrusted up at the positions of the pins 3 to separate the wafer 1 from the table 2, whereby even though a flipping wafer 1 is generated, the peripheral deviation of the wafer 1 from the table 2 is not generated as the wafer 1 is positioned on the inner wall of the cover 4. Hereby, the wafer 1 can be made readily to separate from the table 2, without generating nonconformities in carrying the wafer.</p> |
