发明名称 MANUFACTURE OF EPITAXIAL WAFER FOR FIELD-EFFECT TRANSISTOR
摘要 PROBLEM TO BE SOLVED: To obtain an HEMT(high electron mobility transistor) having a good characteristic, such as a high mobility, etc., by forming a steep hetero-interface by improving the planarity of InGaAs channel layer. SOLUTION: In a method for manufacturing epitaxial wafer, an epitaxial wafer for a field-effect transistor, having such a structure that a buffer layer 2, is provided on a semi-insulating GaAs substrate 1, and an InGaAs channel layer 3 and a carrier supply layer 4 are provided on the buffer layer 2 is manufactured by the MOVPE method. The channel layer 3 is grown, using a group V organo-metallic material, preferably, TMAs in addition to an organo metallic indium material, an organo-metallic gallium material, and arsine.
申请公布号 JP2001044127(A) 申请公布日期 2001.02.16
申请号 JP19990220670 申请日期 1999.08.04
申请人 HITACHI CABLE LTD 发明人 OMURA MASAKAZU;WADA JIRO
分类号 H01L21/205;H01L21/338;H01L29/778;H01L29/812;(IPC1-7):H01L21/205 主分类号 H01L21/205
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