LAMINATED FILM AND PRODUCTION OF PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To obtain a laminated film having a transfer layer which copies the ruggedness of a surface to be subjected to laminating without increasing production cost, capable of enhancing resolution and resist pattern precision and capable of considerably enhancing the production yield of a printed circuit board and to produce the printed circuit board. SOLUTION: The laminated film has a photosensitive resin composition layer 3 on a 1st film 4 with a lubricant-containing layer (X layer) laminated on one face. The load at 5% elongation of the 1st film 4 per unit width at 80 deg.C in the longitudinal direction is 4-90 g/mm. The laminated film 1 is laminated on a substrate 6 in such a way that the photosensitive resin composition layer 3 comes in contact with the substrate 6 and exposure and development are carried out to produce the objective printed circuit board.