| 摘要 |
PROBLEM TO BE SOLVED: To improve the protection of an IC chip to be packaged by providing an intermediate member between a base substrate for loading a chip module and an overlap member to be overlapped on this base substrate. SOLUTION: Concerning a chip card 11, electrically insulated and separated two conductive patterns 13A and 13B are formed on one side (chip surface) 12A of a base substrate 12 using a flexible member such as paper. Then, a single chip 14 as a chip module is electrically connected and loaded between the conductive patterns 13A and 13B. One side (chip side) 15A of an overlap member 15 using the flexible member such as paper is formed in a state of facing the chip surface 12A of the base substrate 12 and being overlapped while interposing an adhesive member 16 as an intermediate member. The adhesive member 16 is interposed for thickness (at least the thickness of the IC chip 14) equal to or more than the thickness of the IC chip 14. |
