| 摘要 |
PROBLEM TO BE SOLVED: To make a light emitting diode thin by making the overall height which includes a mother board as small as possible, when the light emitting diode is mounted on the mother board. SOLUTION: A through-hole 25 is bored in a glass epoxy substrate 22 from its top surface 26a to its bottom surface 26b and is filled with a transparent resin part 27, on which a light emitting diode element 29, whose element substrate is formed of a gallium-nitride based compound semiconductor as transparent sapphire is fixed with a transparent adhesive 37. Furthermore, non- transmission electrodes 33 and 34 are provided above the light emitting diode 29 and the light emitted by the light emitting diode 29 is transmitted through the transparent resin part 27 and guided to the reverse surface 26b of the substrate 22. |
