| 摘要 |
PROBLEM TO BE SOLVED: To securely join components to a circuit substrate by judging the amount of deviation of the relative positions between a nozzle part and the components and controlling the joint operation between the components and a circuit substrate based on the judgment. SOLUTION: A control device 110 sucks and retains semiconductor chips from a component-inverting device 104, controls the operation of an X-axis robot 108 and a Y-axis robot 107, and then moves the chips to a specific position to be joined. Then, a component/circuit substrate recognition camera device 120 is moved, the image of a semiconductor chip and a circuit substrate 20 is picked up, and then the component/circuit substrate recognition camera device 120 are retracted to the rear. Then, the amount of deviation between the nozzle and the semiconductor chip is calculated according to the image pickup information of the semiconductor chip, the amount of deviation is compared with a set value, the correction operation of a final joint position is made when the amount of deviation is smaller than the setting value, and the position correction operation of the X-axis robot 108 and the Y-axis robot 107 is made. |
