发明名称 |
ALKALI DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To attain high productivity and reduction of cost and to ensure satisfactory heat and moisture resistances and superior resistance to the heat of soldering by incorporating a carboxyl-containing photopolymerizable unsaturated compound, an epoxy resin containing a condensed polycyclic aromatic skeleton and a photopolymerization initiator. SOLUTION: The alkali developable photosensitive resin composition contains a carboxyl-containing photopolymerizable unsaturated compound, an epoxy resin containing a condensed polycyclic aromatic skeleton and a photopolymerization initiator as essential components. The carboxyl-containing photopolymerizable unsaturated compound may be obtained by allowing a polyfunctional epoxy acrylate compound to react with an acid anhydride compound. The polyfunctional epoxy acrylate compound may be obtained by allowing a polyfunctional epoxy resin such as bisphenol A type epoxy resin to react with an unsaturated carboxylic acid. |
申请公布号 |
JP2001042525(A) |
申请公布日期 |
2001.02.16 |
申请号 |
JP19990217610 |
申请日期 |
1999.07.30 |
申请人 |
DAINIPPON INK & CHEM INC |
发明人 |
OGURA ICHIRO;HIRAI MIKI;ARITA KAZUO |
分类号 |
H05K3/28;C08L63/10;G03F7/032;H05K3/46 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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