发明名称 ALKALI DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To attain high productivity and reduction of cost and to ensure satisfactory heat and moisture resistances and superior resistance to the heat of soldering by incorporating a carboxyl-containing photopolymerizable unsaturated compound, an epoxy resin containing a condensed polycyclic aromatic skeleton and a photopolymerization initiator. SOLUTION: The alkali developable photosensitive resin composition contains a carboxyl-containing photopolymerizable unsaturated compound, an epoxy resin containing a condensed polycyclic aromatic skeleton and a photopolymerization initiator as essential components. The carboxyl-containing photopolymerizable unsaturated compound may be obtained by allowing a polyfunctional epoxy acrylate compound to react with an acid anhydride compound. The polyfunctional epoxy acrylate compound may be obtained by allowing a polyfunctional epoxy resin such as bisphenol A type epoxy resin to react with an unsaturated carboxylic acid.
申请公布号 JP2001042525(A) 申请公布日期 2001.02.16
申请号 JP19990217610 申请日期 1999.07.30
申请人 DAINIPPON INK & CHEM INC 发明人 OGURA ICHIRO;HIRAI MIKI;ARITA KAZUO
分类号 H05K3/28;C08L63/10;G03F7/032;H05K3/46 主分类号 H05K3/28
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