| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a reflow crack from being generated in other types of packages by gluing a wiring pattern to a first surface via a TAB tape, at the same time equipping the first surface with a stiffener, and composing the stiffener so that a second surface is provided with at least a specific radiation function. SOLUTION: A wiring layer 2 and an adhesive layer 3 are provided on each surface of an insulation layer 1 for forming a TAB tape 1A, and a semiconductor element 4 is glued to a stiffener 51 at the part of an opening 1a of the TAB tape 1A via an adhesive layer 6. The wiring layer 2 of the TAB tape 1A is connected to a bump 7 of the semiconductor element 4, and the connection part is sealed with a mold resin 8. Then, plated layers 11a and 11b are formed on a surface where the semiconductor 4 of the stiffener 51 is mounted and a surface at the opposite side, respectively. The plated layers 11a and 11b are Co-Ni black electrolytic plated layers with a thickness of 0.8μm, and the surface is composed so that it has an axial radiation capability of at least 0.1.</p> |
