| 摘要 |
PROBLEM TO BE SOLVED: To provide wet equipment having satisfactory treating efficiency, where cleaning efficiency of wafers or chemical liquid treating efficiency is high, and a plurality of wafers can be treated simultaneously. SOLUTION: In wet equipment, an outer peripheral chuck unit 3 for holding wafers 1 is arranged in a chamber 2 treating the wafers 1. A treatment chemical liquid piping 8 and a cleaning liquid piping 9 are installed in the outer peripheral chuck unit 3. Treatment chemical liquid spouting nozzles 6, with which the treating chemical liquid piping 8 is connected and which causes a treatment chemical liquid 10 to jet against the wafers 1, or cleaning liquid spouting nozzles 7 with which the cleaning liquid piping 9 is connected and which jet cleaning liquid 11 against the wafers 1 are installed in the outer peripheral chuck unit 3.
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