发明名称 FORMATION METHOD OF TiN FILM AND MANUFACTURE OF ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a reliable barrier film by introducing a mixed gas of carrier gas and high-purity titanium tetra-chloride into a reactor from a vaporizer, and heating a TiN film formation substrate in the reactor to a desired temperature for generating plasma in it. SOLUTION: A titanium tetra-chloride supply device 17 comprises a vessel body 10 of stainless steel whose inside surface is electrolytically polished and a lid part 19 which is provided a titanium tetra-chloride injection opening 12, a supply opening, and an optical liquid-level sensor 13. Firstly, the high-purity titanium tetra-chloride which is a material is fed in the vessel body 10 through the injection opening 12, and the titanium tetra-chloride is fed in a carburetor 4 from the vessel body 10 through the supply opening 11. Then, Ar which is carrier gas is blown into the vaporizer 4 so that a mixed gas is introduced into a reactor 5 while ammonium is blown-in as a nitrogen mixed gas. A high- frequency voltage is applied from a matching unit 3 to generate plasma in the reactor 5 to form a TiN film.
申请公布号 JP2001041802(A) 申请公布日期 2001.02.16
申请号 JP19990220400 申请日期 1999.08.03
申请人 ASAHI DENKA KOGYO KK 发明人 ONOZAWA KAZUHISA;NAKAGAWA SATOSHI
分类号 G01F23/28;C23C16/448;H01L21/28;H01L21/285;(IPC1-7):G01F23/28 主分类号 G01F23/28
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