| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a hollow package capable of being manufactured smaller and at a lower cost. SOLUTION: A common substrate 21, having a multitude of element mounting sections 41, is prepared. A semiconductor chip 29 is secured to an island portion 26 for each section 41. The substrate 21 has a recess 24 formed, while being surrounded by a columnar region 23, the recess 24 serving to accommodate the chip 29 and bonding wires 30 therein. A cover member is fixed by adhesion, so that the recess 24 is completely closed. The cover member, the region 23 and the substrate 21 are cut out in batch along the substantially central portion of the region 23 into individual separate pieces to form electronic components. |
