发明名称 STRUCTURE FOR LEADING OUT LEAD W/H SECTION OF FLEXIBLE PRINTED CIRCUIT BOARD FROM UNIT
摘要 PROBLEM TO BE SOLVED: To prevent the fracture of a lead circuit section without causing the positional deviation of a switch circuit section, even when a tensile stress is applied to the lead circuit section while the lead circuit section is wired or transported, by integrally constituting the switch circuit section with the lead circuit section. SOLUTION: A structure for leading out lead W/H section of flexible printed circuit body from switch unit is contrived to lead out a lead W/H section 37 connected to the circuit section 36 of a circuit unit, which is constituted by housing the circuit section 36 in a housing case 35 composed of an under case 34 and an upper case 33 from the cut section 41 of the under case 34. The structure is provided with through holes 46 and 47 for bosses 42 and 43 on both sides of the lead W/H section 37 and, in addition, the bosses 42 and 43 which are protruded in L-shapes from two spots under the cut section 41 on the side wall of the under case 34. Therefore, the lead W/H section 37 can be retained by the upper case 33 and under case 34 when the through holes 46 and 47 of the W/H section 37 are put on the bosses 42 and 43.
申请公布号 JP2001044668(A) 申请公布日期 2001.02.16
申请号 JP19990215683 申请日期 1999.07.29
申请人 YAZAKI CORP 发明人 SERIZAWA YASUYOSHI;KUBOTA MINORU;SHIRAKI KENTARO
分类号 B60R16/02;H05K7/14;(IPC1-7):H05K7/14 主分类号 B60R16/02
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