| 摘要 |
PROBLEM TO BE SOLVED: To protect a silicon wafer from breaking when the protection tape is peeled by attaching a protection tape for grinding the rear surface to the front surface and then grinding the rear surface while the protection tape is adhered. SOLUTION: A protection tape 12 for processing the rear surface is adhered (a) to the front surface of a silicon wafer 11. This protection tape 12 is a transparent tape. Next, the rear surface of the silicon wafer 11 is ground using a rear surface grinding apparatus to obtain the silicon wafer 11a of the desired thickness (b). Next, while the transparent protection tape 12 is adhered, the rear surface of the silicon wafer 11a is adhered to a dicing tape 13 held with a dicing ring 14 (c). Next, the patterns of semiconductor devices and scribe lines on the surface of the silicon wafer 11a are read from over the transparent protection tape 12 and a semiconductor chip 15 including the predetermined pattern is cut and isolated by inserting a blade end point from the transparent protection tape 12. |
