| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be lessened in thickness, easily manufactured, and is superior in heat dissipation. SOLUTION: A semiconductor element 16 provided with electrode terminals 26 is mounted on the one surface of a circuit board 18 provided with outer connection terminals 20 formed on the other surface of the circuit board 18, and the outer connection terminals 20 and the electrode terminals 26 are connected electrically together for the formation of a semiconductor device 10, where the semiconductor element 16 is mounted enabling its surface where electrode terminals 26 to be provided to confront the circuit board 18. A wiring pattern 22, where bonding parts are provided, is formed on the surface of the circuit board 18 where the external connection terminals 20 are provided. Elliptical holes 30 are formed along the array of the electrode terminals 26 of the semiconductor element 16 so as to make a series of the electrode terminals 26 exposed, a bonding part 24 is formed around each opening of the elliptical holes 30, each of the electrode terminals 20 exposed at the bottom part of the elliptical hole 30 is electrically connected to the bonding part 24 with a bonding wire 28, and the elliptical holes 30 are sealed with resin. |
