| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layer circuit board for making satisfactory a strip line and the cross-sectional shape of a conductive layer formed on the same plane as the strip line, and a method for manufacturing the multi-layer circuit board. SOLUTION: A substrate 1 constituted by laminating plural insulating layers 1a-1g is provided with ground electrodes 3 and 11, and the substrate 1 is provided with a strip line 5 constituted by laminating plural metallic layers 5a and 5b. The thickness of a conductive layer 7 formed on the same insulating layer 1b as the strip line 5 is set so as to be the same as the thickness of the metallic layer 5a in the lowest layer constituting the strip line 5. |
