发明名称 THERMOELECTRIC DEVICE AND MANUFACTURE THEREOF
摘要 <p>The invention provides a thermoelectric device having a simple structure responsive sufficiently to abrupt heating and cooling. A method of manufacturing the thermoelectric device comprises forming an undoped diamond layer (20) as a support on a substrate (10), forming either a p-type diamond layer (30) on the support using an organic boron compound as a dopant or an n-type diamond layer (30) on the support using an organic phosphorus compound as a dopant, and forming an electrode (50) on the doped layers. The method further comprises providing a cooling member (60) on the back of undoped diamond layer (20) after removing substrate (10).</p>
申请公布号 WO2001011698(P1) 申请公布日期 2001.02.15
申请号 JP2000005180 申请日期 2000.08.02
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