发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
A method for manufacturing a semiconductor device in which outer connection faces of the leads that are electrically connected to a semiconductor chip are exposed flush with a surface of the package. The method comprises a resin encapsulating step of integrally forming an encapsulating part for encapsulating the semiconductor chip and a protective resin layer for almost covering the outer connection faces, and a resin removing step of removing at least a part of the protective resin layer to expose the outer connection faces. The resin removing step may be a grinding step of grinding the protective resin layer. |
申请公布号 |
WO0111677(A1) |
申请公布日期 |
2001.02.15 |
申请号 |
WO2000JP05270 |
申请日期 |
2000.08.07 |
申请人 |
ROHM CO., LTD.;SHIBATA, KAZUTAKA |
发明人 |
SHIBATA, KAZUTAKA |
分类号 |
H01L21/56;H01L23/31;H01L23/498 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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