| 摘要 |
Apparatus and method for contactless capturing and transporting a restrained spherical-shaped semiconductor integrated circuit located within transport tube or other component of a spherical-shaped semiconductor integrated circuit manufacturing system and restrained by a fluid flow within a transport tube or other component of the spherical-shaped semiconductor integrated circuit manufacturing system. The apparatus (10) includes a diverging nozzle (22) having an inlet aperture (30), an outlet aperture (32), formed on the exterior side surface (50) thereof and an interior sidewall (28) which defines a generally frusco-conical shaped interior passageway (24) through which gas flows. By repositioning the apparatus (10) from a first position relative to a second position above, below or to one side of the first position, the restrained spherical object (52) may be captured at an equilibrium position relative to the diverging nozzle (22). At the equilibrium position, the atmosphere pressure (56) exerted on a first portion of the generally spherical object (52) located outside the diverging nozzle is equal to an opposing pressure (54) exerted on a second portion of the generally spherical object (52) located within the generally frusto-conical interior passageway (24) of the diverging nozzle (22) by the flow of gas therethrough. Once the generally spherical object (52) has been captured, the apparatus (10) may be relocated to transport the device and the generally spherical object (52) to a destination. During the transportation process, the generally spherical object (52) will remain in the equilibrium position. The captured generally spherical object (52) may then be released by increasing the rate of the flow of gas through the diverging nozzle until the generally spherical object (52) is driven from the equilibrium position.
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