发明名称 METHOD FOR ETCHING SEMICONDUCTOR DEVICE
摘要 PURPOSE: A method for etching a semiconductor device is to precisely regulate critical dimension of a bottom conductive layer upon etching using an anti-reflective layer as an etching mask, thus to form a micropattern. CONSTITUTION: A method for etching a semiconductor device comprises the steps of: successively depositing the first insulation layer(212), a conductive layer(214) and the second insulation layer(216) on a semiconductor substrate(210); forming a photoresist pattern on the second insulation layer; etching the second insulating layer in certain etching atmosphere using the photoresist pattern as an etching mask, so as to form a hard mask; and etching the conductive layer and the first insulating layer using the hard mask as an etching mask, the second insulating layer being an anti-reflective layer.
申请公布号 KR20010011371(A) 申请公布日期 2001.02.15
申请号 KR19990030691 申请日期 1999.07.27
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, JI HWAN;SHIN, CHEOL HO
分类号 H01L21/306;(IPC1-7):H01L21/306 主分类号 H01L21/306
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