发明名称 |
METHOD FOR ETCHING SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A method for etching a semiconductor device is to precisely regulate critical dimension of a bottom conductive layer upon etching using an anti-reflective layer as an etching mask, thus to form a micropattern. CONSTITUTION: A method for etching a semiconductor device comprises the steps of: successively depositing the first insulation layer(212), a conductive layer(214) and the second insulation layer(216) on a semiconductor substrate(210); forming a photoresist pattern on the second insulation layer; etching the second insulating layer in certain etching atmosphere using the photoresist pattern as an etching mask, so as to form a hard mask; and etching the conductive layer and the first insulating layer using the hard mask as an etching mask, the second insulating layer being an anti-reflective layer.
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申请公布号 |
KR20010011371(A) |
申请公布日期 |
2001.02.15 |
申请号 |
KR19990030691 |
申请日期 |
1999.07.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI, JI HWAN;SHIN, CHEOL HO |
分类号 |
H01L21/306;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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